Partner ship
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Global Foundry
- Mass production leveraging global GaN RF and power devices foundries
- Establishment of a stable supply chain through multiple foundry utilization
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In-house R&D and Collaboration using Domestic Facilities
- Mitigating foundry risks
- Continuous design validation
- Securing patents and intellectual property rights
- Process validation for mass production
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Back-End Processing and Packaging
- Joint technology development with domestic and overseas back-end processing partners
- Wafer grinding and back-metal process
- Dicing and packaging
- Development of multiple package types (ceramic, DFN, TO types)
- Advancement of back-end processing technologies
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Product Evaluation and Certification
- Chip failure analysis and reliability enhancement
- Product certification through domestic certification bodies